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Reference Links

etm’s web-based library of electronics thermal management- hardware and software vendors, technical resources and forthcoming symposia is provided for your convenience.

If you wish your Company’s products or activities to be included as a reference link, or have suggestions for improvement, please contact us. This service is free of charge. Please note that etm is not responsible for the content of external Internet sites and does not endorse any vendor or product listed. Our reference links are categorised under the following headings:

Cabinets / Enclosures	Thermal Design Software
Fans / Blowers	Thermal Interface Materials
Heat Sinks	Thermal Mngt. Symposia
Material Property Databases	Technical Resources
Measurement Instrumentation	Wind Tunnels

Cabinets / Enclosures

The following list contains vendors and manufacturers of standard or custom-designed enclosures, and enclosure systems accessories (e.g. cooling solutions including heat exchangers, power and monitoring systems, back-planes, sub-racks, card frames and fan trays, etc.). For fan trays please also check the Fans/Blowers section.

apw	Polar Controls
Hybricon	Rittal
ITS Enclosures	Tracewell Systems
Kooltronic, Inc.

Fans / Blowers

Fans are often used to provide the primary cooling airflow throughout electronic systems. There are a variety of fan designs, which depending upon the impellor form are typically categorised as axial, radial, mixed-flow or cross-flow fans. Fan performance is typically characterised by a performance curve measured by the vendor. However, as these curves represent fan performance in an idealised environment, caution should be taken when extrapolating performance in an application environment. Vendors generally provide advice on fan selection and sizing through data sheets and engineering notes, which deal with issues such as air flow versus pressure drop, acoustic noise, fan control, and fan life and reliability. The fan vendors listed below provide standard or customised designs. For localised cooling, such as CPU cooling, fans may be integrated with a heat sink assembly and therefore please also check the Heat Sinks section.

ADDA USA Corporation	Kooltronic, Inc.
apw	NMB
Comair Rotron	Papst
Delta Electronics	Sanyo Denki
ebm	SUNON
ebm-ZIEHL

Heat Sinks

A heat sink is an extended surface that aids convective and radiative heat transfer from an electronic system. This is a common, cost-effective approach employed in optimising electronic system thermal performance. The vendors listed below offer either passively or actively air-cooled heat sink designs.

Aavid Thermalloy	PSC
Chip Coolers	Radian Heatsinks
Du-all Thermo	R-Theta
ERM	The Metals Group, Inc.
Graftech International, Ltd.	Thermshield, LLC.
IMI Marston, Ltd.	Wakefield
iERC

Material Property Databases

The following links contain material thermal properties for commonly used electronic packaging materials, which may be useful for numerical modelling or material selection.

CINDAS	MatWeb
Goodfellow	K&K Associates

Measurement Instrumentation

All electronic equipment thermal designs ultimately need to be experimentally characterised to verify product performance. The vendors listed below provide flow-, temperature-, heat flux-, acoustic- sound-, and material thermal property measurement instrumentation.

Airflow Technical Products	Hallcrest, Inc.
Analysis Tech	Hot Disk, Inc.
Bruel and Kjaer	Mathis Instruments, Ltd.
Cambrige Accusense	MicRed
Comark	Omega
Dantec Dynamics	RdF Coporation
Dwyer Instruments, Inc.	THERM-X
Flir Systems, Inc.	TSI Incorporated
Furness Controls

Thermal Design Software

A variety of software tools are used to aid the thermal design of electronic systems. These tools may be based on semi-empirical methods, flow network modelling, or numerical methods such as conduction-based or Computational Fluid Dynamics (CFD). Such software tools can be used in combination to optimise the efficiency of the thermal design process.

Ansys	Flomerics
C&R Technologies	Fluent
CFDRC	Harvard Thermal, Inc.
Daat	Innovative Research, Inc.
Dynamic Soft Analysis, Inc.	Maya
Epsilon Ingenierie	MicRed

Thermal Interface Materials

A range of products exist which can be used to minimise interfacial thermal contact resistance, such as tapes, pads, epoxies, greases, and phase-change materials. Typical applications include component/heat sink and component/substrate interfaces.

3M	Graftech International, Ltd.
Aavid Thermalloy	Raychem
Bergquist	Thermagon
Chomerics	Thermoset

Thermal Management Symposia 2004

The following premier thermal management symposia will take place this year.

ASME HTC 2004	IMAPS 2004
ASME IMECE 2004	ITHERM 2004
ECTC 2004	SEMI-THERM 2004
EuroSimE 2004	THERMINIC 2004

Technical Resources

The following links provide general information on various aspects of electronics thermal design through technical articles, vendor notes and databases, and product/service advertisement.

CoolingZone
Electronics Cooling Magazine

Wind Tunnels

Wind tunnels permit the controlled simulation of forced convection airflows within electronic enclosures. Wind tunnel testing therefore forms an integral part of a product thermal design as it permits experimentation to be undertaken in the absence of a complete prototype. Wind tunnels can be used for flow characterisation, flow visualisation, thermal resistance and airflow impedance measurements.

Aerolab
Engineering Laboratory Design, Inc.